Cylindrical Oriflat Grinding Machine 'SCY-200'
Beautifully and precisely finish core ingots! Introducing a fully automatic compound semiconductor grinding machine.
The "SCY-200" is a cylindrical grinding machine that automatically performs the grinding of the core (cylindrical) circumference of semiconductor compounds to specified dimensions and carries out the oriflap processing. The cutting fluid is circulated through a coolant tank for cooling and cleaning. Additionally, by integrating with an IoT system and adding various sensors for data sensing, it enables maintenance management and quality improvement. 【Features】 ■ Automatically grinds the core circumference of semiconductor compounds to specified dimensions and performs oriflap processing ■ Core (workpiece) setup and alignment can be done manually or with a set cart ■ Fully automated from core position correction to grinding, crystal orientation detection, and oriflap processing ■ Cutting fluid is circulated through a coolant tank for cooling and cleaning *For detailed information and product catalogs, please access the related links.
